To finish a cut surface to be as smooth as possible while suppressing the occurrence of the trace of a cutting wire, scuffing, and powder by the peeling of fine unevenness on the surface of a semiplastic body such as uncured ALC (autoclaved lightweight concrete) etc., with regard to an apparatus for cutting the semiplastic body.

In the apparatus for cutting the semiplastic body, at least two pairs of wires arranged in parallel to each other are reciprocated in the length direction, and the semiplastic bodies are moved relatively in the direction crossing the length direction of both wires to be cut in turn. The end parts opposite to each other of the wires to be paired are fixed to a support member such as a frame. A tensioning arrangement for applying tension to each wire is attached to the other end part of each wire.