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Title:
APPARATUS FOR CUTTING WITH WIRE SAW, METHOD FOR CUTTING STRUCTURAL BODY AND METHOD FOR SCRAPING GROUND
Document Type and Number:
Japanese Patent JP2007152795
Kind Code:
A
Abstract:

To provide an apparatus for cutting capable of smoothly cutting or scraping without slip between a driving pulley and a wire saw, and capable of enlarging a cutting width by decreasing the amount of wire saw's sag.

The apparatus comprises a plurality of pulley supporters 1, 1 extending parallel each other with a distance, front pulleys 7, 7 axially supported by the tips of the pulley supporters 1, 1, a rear pulley 12 axially supported backward apart from the front pulley 7 by at least one pulley supporter 7, a wire saw 13 wound endlessly around each pulley 7, 12, a tension applying means for applying a tension to the wire saw 13, and a driving motor circularly running the wire saw 13 wherein the wire saw 13 is wound by a plurality of stages between two adjacent pulleys 7, 7 and a driving motor is connected for driving to at least one of the two adjacent pulleys 7, 7 around which the wire saw is wound by a plurality of stages.


Inventors:
KUBOKI TSUKASA
Application Number:
JP2005352662A
Publication Date:
June 21, 2007
Filing Date:
December 06, 2005
Export Citation:
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Assignee:
HOKUTO MFG
International Classes:
B28D1/08; B24B27/06; E01D24/00; E02B7/00; E04G23/08
Domestic Patent References:
JPH06146285A1994-05-27
JP2001058315A2001-03-06
JP2002079514A2002-03-19
JP2004204624A2004-07-22
Attorney, Agent or Firm:
Hirotaka Hatayama