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Title:
APPARATUS FOR DYNAMIC TEMPERATURE CONTROL AND METHOD FOR DYNAMIC TEMPERATURE CONTROL
Document Type and Number:
Japanese Patent JP2019220150
Kind Code:
A
Abstract:
To provide an apparatus for dynamic temperature control and a method for dynamic temperature control which flow air in a chassis and avoid thermal runaway between an arithmetic module and another component in the chassis.SOLUTION: An apparatus for dynamic temperature control used for dynamic heat energy control comprises: a fan module 240 comprising a plurality of fan units; a deflection member 260 configured to direct airflow received from the fan module; and system components 220 and 225. The apparatus also includes a chassis management controller (CMC) 270, where the chassis management controller is coupled to the fan module, the deflection member, and the system component. The chassis management controller is configured to dynamically control the deflection member so as to direct airflow from the fan module to the system component by accounting for at least one environmental element within the apparatus.SELECTED DRAWING: Figure 3

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Inventors:
YO SHII
Application Number:
JP2019078364A
Publication Date:
December 26, 2019
Filing Date:
April 17, 2019
Export Citation:
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Assignee:
QUANTA COMP INC
International Classes:
G06F1/20; G05D23/19; G06F1/3203; H05K7/20
Domestic Patent References:
JPH10270882A1998-10-09
JP2016122312A2016-07-07
JPH01129497A1989-05-22
JP2007124853A2007-05-17
JP2013186730A2013-09-19
Attorney, Agent or Firm:
Shinei Patent Office