APPARATUS FOR ELECTRICALLY INTERCONNECTING AT LEAST ONE ELECTRONIC COMPONENT AND POWER SUPPLY UNIT INCLUDING MEANS FOR REDUCING LOOP INDUCTANCE BETWEEN FIRST AND SECOND TERMINALS

Japanese Patent JP2012235128

A

To provide an electrical interconnection apparatus which can reduce the value of inductance of a conductive loop between first and second terminals.

The electrical interconnection apparatus comprises: an insulating substrate including a first terminal, a second terminal, and upper and lower surfaces parallel with each other; a first layer arranged in contact with the upper surface while including pads for connecting a current path and an electronic component and forming a first conductive surface; and a conductive loop including the path between the first and second terminals and having an inductance. The apparatus includes means for reducing the inductance of the conductive loop, and the reducing means includes a second conductive layer arranged in contact with the lower surface. The second conductive layer forms a second conductive surface in parallel with the first conductive surface, and includes an electrical link between two conductive surfaces. The first terminal is connected with the first conductive surface, and the second terminal is connected with the second conductive surface.

SELIM DAGDAG
LASSERRE PHILIPPE

JP2012105209A

November 29, 2012

May 02, 2012

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ALSTOM TRANSPORT SA

H01L23/12; H01L25/07; H01L25/18

JP2002373971A	2002-12-26
JP2007287833A	2007-11-01
JP2005026524A	2005-01-27
JPH1012812A	1998-01-16
JP2002165465A	2002-06-07
JP2004186504A	2004-07-02
JP2004266213A	2004-09-24

US20100127400A1

2010-05-27

Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro

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