Title:
APPARATUS FOR MANUFACTURING PLATED WIRE
Document Type and Number:
Japanese Patent JP2004238654
Kind Code:
A
Abstract:
To reduce a cost for manufacturing a plated wire by manufacturing the plated wire while manufacturing an iron wire for plating continuously in a plating process, with such a simple manufacturing facility as to match a quality level required for the plated wire.
The apparatus for manufacturing the plating wire has a cold working machine having two or more pairs of rolls with channels for reducing a cross-sectional area of a wire rod by 5% or more, provided in front of a hot-dip plating tank in the facility for manufacturing the plated wire by immersing the iron wire for plating in a molten metal to plate it, to continuously manufacture the iron wire for plating and the plated wire in one step.
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Inventors:
TAKAHASHI HIDEO
SUGAWARA KATSUTOSHI
YAHAGI YUTAKA
TOMIMURO TAKASHI
OSANAI TAKENORI
SUGAWARA KATSUTOSHI
YAHAGI YUTAKA
TOMIMURO TAKASHI
OSANAI TAKENORI
Application Number:
JP2003027100A
Publication Date:
August 26, 2004
Filing Date:
February 04, 2003
Export Citation:
Assignee:
HOKKAI KOKI KK
International Classes:
B21C1/00; B21C3/08; C23C2/02; C23C2/38; (IPC1-7): C23C2/02; B21C1/00; B21C3/08; C23C2/38