To provide an apparatus for manufacturing a convenient and easy-to- spread printed wiring board, without causing increase of manufacturing cost and to produce a high density high accuracy printed wiring board with high yield by making uniform the etching accuracy of upper and lower surfaces, without lowering productivity.

A high density high accuracy printed wiring board can be produced with high yield, by making uniform the etching accuracy at the central part and peripheral part on the upper surface of the printed wiring board, without lowering productivity in the etching thereof using an apparatus for manufacturing a printed wiring board, where a nozzle pipe located in the center has a diameter larger than that of nozzle pipes on the opposite sides or a pipe coupled with the nozzle pipe located in the center has a diameter larger than that of nozzle pipes on the opposite sides.