Title:
APPARATUS FOR MEASUREMENT OF ELECTRIC CHARACTERISTIC OF SEMICONDUCTOR WAFER BODY
Document Type and Number:
Japanese Patent JPH06140478
Kind Code:
A
Abstract:
PURPOSE: To measure an electrical characteristics of a semiconductor wafer, without causing wafer stains or surface defects by providing a head part contact mercury probe, etc. CONSTITUTION: A supporting means 14, which supports a semiconductor wafer main body 12 at a specified position, a head part contact mercury probe means 16 which makes a contact through a mercury column, to an upper part surface 18 of the wafer main body 12 comprising a capillary means 22 consisting of a mercury column, and an air pressure control means 24 which supplies a vacuum or pressure to the mercury column in the capillary means 22, are provided. Further, a probe arm-positioning means 26, which is kinematically stable, comprising a probe arm 28, fixed to which head part contact mercury probe means 16 and a wafer main body horizontal/rotational movement means 52 for moving rotationally or horizontally the wafer main body 12 are provided. Further, a measurement means 68 for measuring an electrical characteristics of the wafer main body 12, while allowing a current to pass the wafer main body 12 and first and second electric contact means 64, 66a, and 66b are provided.
Inventors:
ROBAATO JII MEIZAA
ROBAATO SHII SUTEFUANSON
DONARUDO EI JIIIA JIYUNIA
ROBAATO SHII SUTEFUANSON
DONARUDO EI JIIIA JIYUNIA
Application Number:
JP8102391A
Publication Date:
May 20, 1994
Filing Date:
March 19, 1991
Export Citation:
Assignee:
SORITSUDO STATE MEJIYAMENTSU I
International Classes:
G01R1/067; H01L21/66; G01R1/06; (IPC1-7): H01L21/66; G01R1/06
Attorney, Agent or Firm:
Yoshiaki Ikeuchi