Title:
堆積チャンバへのプロセス材料の流れを制御するための装置及び方法
Document Type and Number:
Japanese Patent JP7413285
Kind Code:
B2
Abstract:
Methods and apparatus for controlling a flow of process material to a deposition chamber. In embodiments, the apparatus includes a deposition chamber in fluid communication with one or more sublimators through one or more delivery lines, wherein the one or more sublimators each include an ampoule in fluid communication with the one or more delivery lines through an opening, and at least a first heat source and a second heat source, wherein the first heat source is a radiant heat source adjacent the ampoule and the second heat source is adjacent the opening, wherein the one or more delivery lines include one or more conduits between the deposition chamber and the one or more sublimators, and wherein the one or more conduits include one or more valves to open or close the one or more conduits, wherein the one or more valves in an open position prevents the flow of process material into the deposition chamber, and wherein the one or more valves in a closed position directs the flow of process material into the deposition chamber.
Inventors:
Lerner, Alexander
Shabib, Roy
stout, philip
Lanish, Joseph M.
Kosna, Prashant
Rada Krishnan, Satish
Shabib, Roy
stout, philip
Lanish, Joseph M.
Kosna, Prashant
Rada Krishnan, Satish
Application Number:
JP2020569930A
Publication Date:
January 15, 2024
Filing Date:
June 17, 2019
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/31; C23C16/448
Domestic Patent References:
| JP2014194964A | ||||
| JP2011054789A | ||||
| JP2006339461A |
Attorney, Agent or Firm:
Sonoda & Kobayashi Patent Attorneys Corporation
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