To overcome the problem that, while cutting a substrate scribed by laser provides a finished product having very high strength owing to scratch-free cut surfaces, with minute scratches deteriorating the breaking strength.

An apparatus and a method for cutting a nonmetallic substrate carry out cutting a nonmetallic substrate into first and second portions along a predetermined cutting line. The apparatus includes a first substrate holding means of holding a first portion of the substrate, a second substrate holding means of holding a second portion of the substrate after cutting, a means of forming a scribe line on the surface of the substrate from the starting end to the terminal end of the predetermined cutting line, and a means of applying a bending moment to extend the scribe line while following the means of forming the scribe line, and also has a mechanism holding the first and second cut portions of the substrate at predetermined intervals while holding the first portion of the substrate with the first substrate holding means.