To provide an apparatus for double-side polishing, which securely holds a workpiece in a holding hole of a carrier without the jumping out of the workpiece from the holding hole after inserting the workpiece into the holding hole of the carrier when the workpiece, such as a semiconductor wafer, is polished by a double-side polishing apparatus.
The double face polishing apparatus comprises upper and lower polishing plates 26a, 26b, polishing cloths 27a, 27b stuck to the upper and lower polishing plates respectively, a carrier 4 having holding holes 5 for holding waferlike workpieces W between the upper and lower polishing cloths, a polishing slurry supplying means 23 for supplying polishing slurry between the polishing cloths and the workpiece, and a gas blowing means 8 for scattering liquid from the carrier and/or the polishing cloth by blowing gas against at least the carrier and/or the polishing cloth on the lower polishing plate. After the carrier has been set on the polishing cloth of the lower polishing plate, the liquid is scattered from the carrier and/or the polishing cloth on the lower polishing plate before the workpiece is inserted into the holding hole of the carrier.
KON SHINICHI
HIRANO YOSHIHIRO
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