To implement every stage of a film formation process by the electrolytic plating method efficiently and safely within a single chamber.

An electrolytic plating tank 12 is disposed in the inside of the lower part of a treatment chamber 10 which can be sealed, and an atmosphere of an inert gas is formed in a processing space PS set on or above the electrolytic plating tank 12. An exhaust path 38 which leads to an external exhaust system, and one or more spray nozzles for cleaning liquids/drying gases 40 are provided in a partition part 36. A handling mechanism 52 for dipping the treating surface of a substrate W to be treated into the plating bath of the electrolytic plating tank 12 by the face-down system is provided in an inner space above the partition part 36. This handling mechanism 52 has a box-shaped substrate support member 54 with its lower surface opened, a rotary drive part 58 for carrying out the spin revolution of this substrate support 54 integrally with a perpendicular supporting shaft 56, and a vertical movement drive part 60 for carrying out the vertical movement of this rotary drive part 58 or the substrate support member 54. A heating means, for example, a lamp unit for annealing the substrate W is provided in the substrate support 54.