Title:
基板表面から異物を静電的に除去するための装置及び方法
Document Type and Number:
Japanese Patent JP7348454
Kind Code:
B2
Abstract:
In one exemplary embodiment, described herein are innovative techniques for reducing the attractive force between particles and a substrate surface to aid in the removal of particles from the substrate surface. More specifically, a multi-electrode chuck is utilized to assist in cleaning a substrate. The multi-electrode chuck is utilized to reduce the attractive forces between particles and the substrate and to move the loosened particles that are present on the substrate surface. The electrodes of the chuck are biased with alternating current (AC) voltages with a phase shift between the electrode bias waves. The resulting electric field wave on the substrate surface loosens the particles by polarizing the particles and moves the loosened particles across the substrate.
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Inventors:
Rotondaro, Antonio
Bassett, Derek
Hard, trace
Sims, Ethan
Bassett, Derek
Hard, trace
Sims, Ethan
Application Number:
JP2021543110A
Publication Date:
September 21, 2023
Filing Date:
September 17, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304; B03C7/02; H01L21/683
Domestic Patent References:
| JP2004259832A | ||||
| JP2013197465A | ||||
| JP2005072175A |
Foreign References:
| US20160236245 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito