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Title:
APPARATUS AND METHOD FOR HEAT TREATMENT BY LIGHT IRRADIATION
Document Type and Number:
Japanese Patent JP2002118071
Kind Code:
A
Abstract:

To uniformly heat a wafer as well as to efficiently heat a guard-ring.

Lamps L1-L10 of a light source 1 consist of lamps L1-L8 for heating the wafer and lamps L9, L10 for heating the guard ring. The distance from the lamps L9, L10 for heating the guard ring to the guard ring 3 is larger than that from the lamps L1-L8 for heating the wafer to the wafer W. A side wall 4 between the lamps L1-L8 and the lamps L9, L10 is finished to be a mirror face, so that as to the light radiated from the lamps L9, L10 toward the wafer W is reflected toward the guard ring 3. Also a second side wall 5 is formed in the circumference of the lamps L9, L10 for heating the guard ring, making the side wall 5 a reflecting face. Furthermore, in the circumference of the guard ring 3, a second mirror 6 is provided, to concentrate the light radiated on the outer side of the guard ring 3, to the guard ring 3.


Inventors:
SUZUKI SHINJI
MIMURA YOSHIKI
Application Number:
JP2000309024A
Publication Date:
April 19, 2002
Filing Date:
October 10, 2000
Export Citation:
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Assignee:
USHIO ELECTRIC INC
International Classes:
F27D11/02; H01L21/00; H01L21/205; H01L21/26; (IPC1-7): H01L21/26; F27D11/02; H01L21/205
Attorney, Agent or Firm:
Shunichiro Nagasawa