To perform highly accurate and high-throughput inspections on wafers by both a bright field image and a dark field image.
This wafer inspection apparatus has first and second incident illuminating devices for irradiating a region of the surface of a wafer and at least one image sensing device for sensing the image of the illuminated region. By the arrangement of the first incident illuminating device and the at least one image sensing device, an image of the illuminated region is sensed in a bright field arrangement. By the arrangement of the second incident illuminating device and the at least one image sensing device, the image of the illuminated region is sensed in a dark field arrangement. A control device is further provided for controlling the first and second incident illuminating devices and the at least one image sensing device. The image in the bright field arrangement and the image in the dark image arrangement are acquired at a temporal deviation from each other or separated from each other by color and then acquired.
KREH ALBERT
BACKHAUSS HENNING
| JPH11194098A | 1999-07-21 | |||
| JP2000241362A | 2000-09-08 | |||
| JP2003185593A | 2003-07-03 |