To provide an apparatus and a method for laser beam machining for high-quality machining.
The apparatus for laser beam machining includes: a light source for emitting a laser beam; a stage having a holding surface for holding a workpiece; an optical system propagating the laser beam emitted from the light source to the stage and being controlled for propagation and non-propagation based on a signal from the outside; and a controller for transmitting the signal to the optical system and controlling the propagation and non-propagation of the laser beam to the stage; an irradiation prohibiting region where the irradiation of the laser beam is prohibited and an irradiation permissible region where the irradiation of the laser beam is permitted arranged on the holding surface of the stage with the workpiece held in the stage; the controller storing the position information of a boundary line between the irradiation prohibiting region and the irradiation permissible region; and the propagation and non-propagation of the laser beam to the stage controlled on the basis of the position of the stage and the position information of the boundary line not to irradiate the irradiation prohibiting region with the laser beam.
| JPS6352442A | 1988-03-05 | |||
| JP2009160625A | 2009-07-23 | |||
| JPH06320292A | 1994-11-22 | |||
| JP2008053528A | 2008-03-06 | |||
| JPH11147186A | 1999-06-02 | |||
| JP2005311327A | 2005-11-04 | |||
| JPS6352442A | 1988-03-05 | |||
| JP2009160625A | 2009-07-23 |
Mikio Kuruyama
Ukai Shinichi