To perform highly precise irradiation of laser beam to a point to be treated by suppressing influence of bubbles generated in a liquid, when laser processing is carried out while supplying the liquid on a substrate.
The laser processing apparatus comprises a beam irradiation unit to irradiate laser beam L1 to the point to be treated on the substrate W, a liquid supply unit, and a liquid outlet hole 51a with an inside diameter of 0.4-1.0 mm connected to the liquid supply unit via liquid supply path, a supply nozzle 51 to supply the liquid sent from the liquid supply unit onto the substrate W at a depression angle of 20-35° and at a flow rate of 20-30 m/s, and a guiding member 56 to guide the spouted liquid. A moving mechanism is also provided in order to move the substrate holder 21, the laser irradiation unit, the guiding member 56 and the supply nozzle 51 altogether horizontally and relatively while keeping such a state that a center of the irradiation spot of the laser beam stays within a projection zone R on the substrate W, which is figured by extending the liquid outlet 51a of the supply nozzle 51 to the spouting direction.
| JP2015526298 | Laser welding method and laser welding member using it |
| WO/2021/148600 | VOLUME HEAT TREATMENT METHOD AND RELATED SYSTEM |
KOGA NORIHISA
YOSHITAKA NAOTO
| JP2003249427A | 2003-09-05 | |||
| JP2000317659A | 2000-11-21 | |||
| JPH09141484A | 1997-06-03 |
Mizuno Hiromi
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