Title:
APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3161428
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To quickly identify a location with no semiconductor element mounted and to quickly bond a correctly fixed semiconductor element, without causing the vacuum level to be lowered.
SOLUTION: A plurality of semiconductor elements 3 are bonded in parallel to a lead frame 1, the lead frame 1 is moved, and the semiconductor elements 3 are fixed and set in parallel to a plurality of chuck positions 6A, 6B, corresponding to bonding positions by the vacuum chucking. An vacuum chucking means comprises a plurality of vacuum chuck holes 7A, 7B, a plurality of pipings 8A, 8B connected thereto, a plurality of openable valves 9A, 9B inserted therein, and a sensor 10 for detecting the vacuum level in the pipings 8A, 8B which are disposed at the suction side therefrom. The opening/closing of the individual valves 9A, 9B is controlled to close the valve 9B, corresponding to an incorrectly located semiconductor element and open the valve 9A corresponding to a correctly located semiconductor element to fix only the appropriately located semiconductor element, thereby appropriately bonding only the appropriately located semiconductor element.
Inventors:
Takeshi Kida
Application Number:
JP29413398A
Publication Date:
April 25, 2001
Filing Date:
October 15, 1998
Export Citation:
Assignee:
NEC
International Classes:
B23P21/00; H01L21/50; H01L21/60; H05K13/04; H05K13/08; (IPC1-7): H01L21/60
Domestic Patent References:
| JP878464A | ||||
| JP5687336A |
Attorney, Agent or Firm:
Minoru Kudo (1 person outside)