Title:
APPARATUS AND METHOD FOR MOUNTING CONDUCTIVE BALL
Document Type and Number:
Japanese Patent JP3546826
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus and method for mounting conductive balls which can prevent nonconformities, resulting from the scattering of the paste.
SOLUTION: In vacuum-chucking the conductive balls 6 by a suction head 13 and then carrying and mounting them on a substrate 3, projecting parts 13b, formed on the lower face of the suction head 13, are abutted against the upper face of the substrate 3, when mounting the balls. Thereby, air outflow from a space between the lower face of the suction head 13 and the upper face of the substrate 3 is regulated to suppress air blowout from suction holes 13a in the space. Consequently, a paste 19 on an electrode 3a is prevented from scattering, due to the air blowout from the suction holes 13a.
Inventors:
Shinichi Nakazato
Application Number:
JP2000279685A
Publication Date:
July 28, 2004
Filing Date:
September 14, 2000
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B25J15/06; B23K1/00; B23K3/06; H01L21/60; H05K3/34; (IPC1-7): H01L21/60; B23K3/06; H05K3/34
Domestic Patent References:
| JP10335338A | ||||
| JP11289026A | ||||
| JP2000117566A |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito