APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

Japanese Patent JP3843850

B2

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and an electronic component mounting method that can shorten image capturing time and improve the efficiency in image recognition.
SOLUTION: In the electronic component mounting apparatus, an electronic component that is retained to a transfer head 8 is imaged by a camera 9 having a line sensor 11, the position of the component is recognized, and then the component is mounted on a board. A plurality of pieces of information on the capturing range of an image by the line sensor 11 are stored in a storage section 13. Information on one capturing range is referred to by a pixel selection section 10, a pixel for outputting an image signal is selected, and the image signal is output only from the selected pixel. A change signal from a facility control section 25 of an entire control apparatus 20 is received, and information on the capturing range that is referred to by the pixel selection section 10 is switched to another capturing range. As a result, image-capturing time is shortened, and efficiency in image recognition is improved.

JP2502495	[Title of Invention] Image Processing Device
JP2005218645	METHOD AND APPARATUS FOR EXTRACTING THREE-DIMENSIONAL GRADATION IMAGE, AND STORAGE MEDIUM WITH THREE-DIMENSIONAL GRADATION IMAGE EXTRACTION PROGRAM STORED THEREON
JPS5866935	RADIATION PICTURE INFORMATION RECORDING AND READING DEVICE

Makoto Arase
Takayuki Hatase

JP2002018083A

November 08, 2006

January 28, 2002

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Matsushita Electric Industrial Co., Ltd

G06T1/00; H05K13/04; H05K13/08; (IPC1-7): H05K13/04; G06T1/00; H05K13/08

JP9186492A
JP10065400A

Fumio Iwahashi
Hiroki Naito
Daisuke Nagano

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