APPARATUS AND METHOD FOR POLISHING PLATE-SHAPED WORK

Japanese Patent JP2004268249

A

To solve the following problem: the front end of a printed circuit board material have a possibility of breakage when a polished face is curved so as to protrude and the front end of the printed circuit board material, especially an ultra-thin printed circuit board material leaves roller pairs for polishing and the material is conveyed to conveyance roller pairs which consist of the conveyance rollers arranged at upper and lower portions.

The printed circuit board material W passes through the rollers 5a for polishing the lower surface and when the lower surface side of the printed circuit board material W is polished, the printed circuit board material W is curved downwards. The printed circuit board material W is guided by guide members 69, 70 and enters between the conveyance rollers 65, 67 of the conveyance rollers 41. A sheet 75 of the guide member 69 is attached to a peripheral surface of a back-up roller 11, therefore it also serves as a scraper for scraping polishing refuse adhering to the peripheral surface of the backup roller 11.

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SUZUKI TOSHIHIRO
SUZUKI NOBUHIKO
TASHIRO HIROSHI

JP2004020919A

September 30, 2004

January 29, 2004

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MARUGEN TEKKOSHO KK
YAMANASHI MATSUSHITA ELECTRIC

B24B29/00; B23Q11/08; B24B7/12; B24B29/06; H05K3/26; (IPC1-7): B24B29/00

JPH0621279U	1994-03-18
JPS59110549A	1984-06-26
JP2001328046A	2001-11-27
JPH06126611A	1994-05-10
JPS5924951A	1984-02-08

Koji Kikkawa
Akiko Yoshikawa

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