Title:
APPARATUS AND METHOD FOR POLISHING
Document Type and Number:
Japanese Patent JP2001291690
Kind Code:
A
Abstract:
To provide a polishing apparatus and a polishing method for mirror surface polishing a work (wafer) with high efficiency and accuracy, a novel board for holding a work efficiently, and a method for bonding a work to the work holding board with high accuracy.
The polishing apparatus 28 comprises a turntable 29, and a work holding board 38 and polishes a work W held by the work holding board 38, while supplying polishing agent solution, where the variations in the turntable 29 in the direction normal to the surface thereof and/or variations in the work holding board 38 in the direction normal to the work holding surface thereof is limited to 100 μm or smaller at polishing operation.
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Inventors:
KIUCHI ETSUO
HAYASHI TOSHIYUKI
HAYASHI TOSHIYUKI
Application Number:
JP2001019020A
Publication Date:
October 19, 2001
Filing Date:
January 26, 2001
Export Citation:
Assignee:
SHINETSU HANDOTAI KK
MIMASU SEMICONDUCTOR IND CO
MIMASU SEMICONDUCTOR IND CO
International Classes:
B24B37/015; B24B37/12; B24B37/30; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; B24B37/04
Attorney, Agent or Firm:
Shoji Ishihara
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