Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
APPARATUS AND METHOD FOR POLISHING
Document Type and Number:
Japanese Patent JP2008114329
Kind Code:
A
Abstract:

To provide a polishing apparatus capable of realizing polishing of double side surfaces of a groove formed in a work with high accuracy in a short time.

This polishing apparatus includes: a pair of polishing members 80 for respectively polishing the double side surfaces 6 of the groove 4 formed in the work 2; a holder 62 to which both of the polishing members 80 are attached; a work driving part and an oscillation mechanism part which change a relative position of the groove 4 to the holder 62 in a longitudinal direction of the groove as a position change device; an expansion member 70 which is disposed between the respective polishing members 80 and is expanded by receiving air pressure to press the respective polishing members 80 to a side surface 6 of a polishing objected article; and a fluid pressure supply part which supplies air fluid pressure to the expansion member 70 as a supply device.


More Like This:
Inventors:
MINAKI SATOMI
KOMATSU SETSU
AZUMA HIDEYUKI
TAKEUCHI YUJI
MIZUNO ISAO
IWASAKI KAZUTOSHI
SUGAWARA TATSUYA
IWAKOSHI TAKAHIRO
ORIBE TSUNEHISA
Application Number:
JP2006299586A
Publication Date:
May 22, 2008
Filing Date:
November 02, 2006
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENSO CORP
International Classes:
B24B33/05; B24B19/02
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe