To provide an apparatus and method for processing a substrate capable of cleaning circumferential edge regions and circumferential end surfaces of both surfaces of a substrate, and easily changing a cleaning width of each of the circumferential edge regions.
The substrate processing apparatus includes a first brush 84 and a second brush 88. The side surface of the tip of the first brush 84 forms a circle pyramid surface and is a cleaning surface 98 abutting on the circumferential edge region 13 and the circumferential end surface 15. On the contrary, the side surface of the tip of the second brush 88 forms a circle pyramid surface and is a cleaning surface 99 abutting on the circumferential edge region 14 and the circumferential end surface 15. The circumferential edge region 13 and the circumferential end surface 15 of the wafer W can be cleaned by allowing the cleaning surface 98 of the first brush 84 to abut on the circumferential edge region 13 and the circumferential end surface 15, and the circumferential edge region 14 and the circumferential end surface 15 of the wafer W can be cleaned by allowing the cleaning surface 99 of the second brush 88 to abut on the edge circumferential region 14 and the circumferential end surface 15.
COPYRIGHT: (C)2008,JPO&INPIT
HIRAOKA NOBUYASU
OKUMURA TAKESHI
NAKANO AKIYOSHI
DAINIPPON SCREEN MFG
| JP2003151943A | 2003-05-23 | |||
| JP2000049131A | 2000-02-18 | |||
| JPH10261605A | 1998-09-29 |
Mio Kawasaki
Next Patent: APPARATUS AND METHOD FOR PROCESSING SUBSTRATE