To set a substrate at a target temperature required by an exposure machine S4 in a substrate processing apparatus that performs application and development processes to the substrate, irrespective of atmospheric temperature variations inside an interface block S3.
A substrate is conveyed from an interface block S3, whose temperature is controlled by a temperature control plate 53, to an exposure machine S4. A temperature of a temperature control fluid passing through the temperature control plate 53 is detected, and a chiller 5 is controlled on the basis of a set temperature. Further, a temperature of an atmosphere inside the interface block S3 or a temperature of the conveyed substrate in the atmosphere is detected, and the set temperature of the temperature control fluid is controlled on the basis of the detected temperature. Alternatively, for example, when the temperature of the atmosphere departs from the target temperature, a conveyance speed of the substrate is controlled higher than a conveyance speed when the temperature of the atmosphere is the target temperature.
KANEKAWA KOZO
ENOKIDA SUGURU
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Tomoaki Miida