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Patent Searching and Data


Title:
APPARATUS AND METHOD FOR SUBSTRATE COATING
Document Type and Number:
Japanese Patent JP2004335728
Kind Code:
A
Abstract:

To provide a substrate coating apparatus and substrate coating method which automatically measures a distance between the origin and a substrate and then controls a distance between the coated surface of the substrate and a nozzle based on the measurement data.

The substrate coating apparatus 1 raises a coating liquid 20 stored below a substrate 10 by the capillary phenomenon, brings the coating liquid 20 into contact with the coated surface of the substrate 10 faced downward, and then relatively moves the nozzle 24 and the substrate 10 to form a coating film. The substrate coating apparatus 1 comprises a linear gauge 7 as a measuring means for measuring a distance h1 to the coated surface of the substrate 10, lift 22 for moving the nozzle 24 up and down, and a controlling means 6 for controlling the lift 22 based on the measurement results measured by the linear gauge 7.


Inventors:
MOTOMURA SHUHO
Application Number:
JP2003129371A
Publication Date:
November 25, 2004
Filing Date:
May 07, 2003
Export Citation:
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Assignee:
HOYA CORP
International Classes:
G03F7/16; B05C5/02; B05C11/00; B05C11/105; B05D1/26; H01L21/027; (IPC1-7): H01L21/027; B05C5/02; B05C11/00; B05C11/105; B05D1/26; G03F7/16
Attorney, Agent or Firm:
Kihei Watanabe