Title:
APPARATUS AND METHOD FOR TEST OF IC DEVICE
Document Type and Number:
Japanese Patent JP3584845
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To test an IC device quickly, efficiently and smoothly even when a large difference exists in the time for tests executed regarding individual IC devices.
SOLUTION: The IC device D is placed on each socket 11 of a test board 4, and its electric characteristic is tested. The test of the IC device D by an IC tester T is performed respectively independently with reference to each socket 11. Whenever the test of the IC device D placed on each socket 11 is finished, a signal to drive a device transfer means 30 is output to a controller C from the IC tester T. The IC device D whose test is finished is taken out from the socket 11 by the device transfer means 30, and an IC device D to be tested newly is placed. That the IC device D to be tested newly is placed on the socket 11 is detected by an optical sensor 19 which is installed at each socket 11, and the IC device D placed on the socket 11 is tested.
Inventors:
Suzuki, Tetsuya
Okitsu, Hikari
Okitsu, Hikari
Application Number:
JP2000000074694
Publication Date:
August 13, 2004
Filing Date:
March 16, 2000
Export Citation:
Assignee:
HITACHI ELECTRONICS ENG CO LTD
International Classes:
G01R31/26; B65G57/04; B65G59/02; H01L21/66; (IPC1-7): G01R31/26
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