Title:
APPARATUS AND METHOD FOR ULTRASONIC SOLDERING
Document Type and Number:
Japanese Patent JP2004098104
Kind Code:
A
Abstract:
To attain secured joint strength and excellent appearance of members after joining.
At a joint point of one of members to be joined 1, the joint point of the other member to be joined 2 is arranged. In an ultrasonic soldering apparatus which comprises a heating means to melt solder and an ultrasonic oscillation emitting means to apply ultrasonic oscillation, and joins the members to be joined by soldering under the ultrasonic oscillation, a guide member 4 facing the periphery portion around the joint point is prepared at least in a part of the periphery portion around the joint point 11 of the member to be joined 1.
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Inventors:
Yotsuya, Yoshitaka
Application Number:
JP2002000261490
Publication Date:
April 02, 2004
Filing Date:
September 06, 2002
Export Citation:
Assignee:
SUZUKI MOTOR CORP
International Classes:
B23K1/06; B23K1/14; B23K1/06; B23K1/14; (IPC1-7): B23K1/06; B23K1/14