Title:
APPARATUS AND METHODS FOR BONDING LAMINATE STRUCTURES
Document Type and Number:
Japanese Patent JP2016022738
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To solve the problem of conventional bonding methods being inadequate for several types of laminates, i.e., incapable of significantly reinforcing the laminates and/or overly burdensome to use during construction of a composite laminate structure.SOLUTION: A composite laminate reinforcing tool may be used to form a reinforced joint at a bond line of a composite laminate structure. The reinforcing tool may hold one or more clips having posts, and may be positioned along the bond line between at least two composite laminate elements. Joint sections of the clip may be heated to increase a pliability of the joint section, and the reinforcing tool may be actuated to drive the post through the at least two composite laminate elements. The posts may deflect toward a base of the clip, thereby to seat the clip. The reinforced composite laminate structure may then be cured.SELECTED DRAWING: Figure 1
Inventors:
RICHARD L KULESHA
Application Number:
JP2015038003A
Publication Date:
February 08, 2016
Filing Date:
February 27, 2015
Export Citation:
Assignee:
BOEING CO
International Classes:
B29C65/60; B64C1/00; B64C1/12; B64F5/00; F16B5/06; F16B11/00
Domestic Patent References:
| JPS55138491A | 1980-10-29 | |||
| JPH05501994A | 1993-04-15 | |||
| JPS49111744A | 1974-10-24 | |||
| JPS49104760A | 1974-10-03 | |||
| JP2013252648A | 2013-12-19 |
Foreign References:
| WO2011105540A1 | 2011-09-01 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Tatsuhiko Abe
Kuroda Shinpei
Choi
Tatsuhiko Abe
Kuroda Shinpei
Choi
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