Title:
APPARATUS FOR MOLDING CORE OF VACUUM INSULATION MATERIAL, AND VACUUM INSULATION MATERIAL MANUFACTURED THEREBY
Document Type and Number:
Japanese Patent JP2014095471
Kind Code:
A
Abstract:
To provide an apparatus for molding a core of a vacuum insulation material, capable of molding a pattern on a surface of the core so that a packaging material can closely adhere to the core and capable of easily discharging air and foreign objects from a molding space.
The apparatus comprises: a pair of molding plates distanced from and facing each other to form a molding space where a core is molded, where the molding plates comprise a pattern portion that transcripts a pattern on the core and an exhaust cavity penetrating therethrough in a thickness direction; a molding cast to close the molding space from the outside; and a pressing portion to press at least one of the pair of molding plates.
Inventors:
KIM HAE DUCK
KIM HYUN CHEOL
LIN SINSUP
KIM HYUN CHEOL
LIN SINSUP
Application Number:
JP2013231553A
Publication Date:
May 22, 2014
Filing Date:
November 07, 2013
Export Citation:
Assignee:
OCI CO LTD
International Classes:
F16L59/06; B30B9/00
Domestic Patent References:
| JP2004245258A | 2004-09-02 | |||
| JPS6467302A | 1989-03-14 | |||
| JP2005106090A | 2005-04-21 |
Foreign References:
| US2026940A | 1936-01-07 | |||
| EP1106336A1 | 2001-06-13 |
Attorney, Agent or Firm:
Maeda/Suzuki International Patent Corporation