To provide a technology by which the temperature of glass is kept at an appropriate temperature when the glass is molded.
This apparatus for molding glass is constituted of: a molding ring 24 for supporting the edge parts 53 of the glass 11 in which a first heater 27 is incorporated; a mold 29 for molding the glass 11 by pressing the glass 11 from above, in which a second heater 28 is incorporated; and third heaters 40 for warming the center part 55 of the glass 11 from below, which are provided in the opening 19 of the molding ring 24. Thereby, the whole surface of the glass 11 is heated. Accordingly, when the glass 11 is molded, the temperature of the glass 11 is prevented from being lowered, and the temperature of the glass 11 is kept at the appropriate temperature.
UETANI HISASHI
JP2004203678A | 2004-07-22 | |||
JPS62157939U | 1987-10-07 | |||
JP2004203676A | 2004-07-22 | |||
JP2005001919A | 2005-01-06 | |||
JPH0558659A | 1993-03-09 | |||
JP2006342055A | 2006-12-21 | |||
JP2004203678A | 2004-07-22 | |||
JPS62157939U | 1987-10-07 | |||
JP2004203676A | 2004-07-22 |
WO2004058653A1 | 2004-07-15 |