Title:
APPARATUS FOR MOUNTING DENSE CHIP
Document Type and Number:
Japanese Patent JP3651790
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus for mounting dense chips using a heat pipe and a thermoelectronic cooler.
SOLUTION: The apparatus includes an evaporator region, a condenser region and a capillary region. The evaporator region includes at least one hot point element for conducting heat from a thermal source to a transport fluid. The transport fluid changes a state and becomes vapor when heated. The vapor moves to the condenser region through vapor channels and dissipates heat to the heat sink and returns to a fluid (condensed transport fluid) again. Then the condensed transport fluid returns to the evaporator region by a capillary force and the capillary formed into capillary structure. The capillary formed into the capillary structure makes a dendritic shape or a fractal shape. In addition, the apparatus can include a flexibility region. The apparatus can circumferentially be bent around corners and an edges.
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Inventors:
Uttam Shire Marined Gothal
Application Number:
JP2001352989A
Publication Date:
May 25, 2005
Filing Date:
November 19, 2001
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
F28D15/02; F28D15/04; H01L23/38; H01L23/427; H05K7/20; F25B23/00; F25D19/00; (IPC1-7): H01L23/427; F28D15/02
Domestic Patent References:
| JP2000161879A | ||||
| JP58110993A | ||||
| JP509145A | ||||
| JP634284A | ||||
| JP10284685A | ||||
| JP8204373A |
Attorney, Agent or Firm:
Hiroshi Sakaguchi
Yoshihiro City
Yoshihiro City