Title:
APPARATUS FOR PRODUCING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPH02205695
Kind Code:
A
Abstract:
PURPOSE:To prevent upper electrodes from being subjected to an unnecessary treatment by a treating liquid by enclosing the circumference of the plural upper electrodes which hold a semiconductor wafer with the surface to be treated face downward with insulating fluid in the upper part of a treating tank of a jet type. CONSTITUTION:The treating liquid is introduced into the treating tank from below and is made to overflow from the top thereof. A lower electrode is disposed in this treating tank and the upper electrodes projecting slightly from the top end are disposed in the upper part thereof. The semiconductor wafer 5 with the surface to be treated thereof faced downward is held on the above-mentioned upper electrodes 10. While the treating liquid 8 is injected toward the surface to be treated, the upper and lower electrodes are energized, by which the semiconductor wafer 5 is subjected to treatments, such as plating and chemical conversion. The upper electrodes 10 of the above- mentioned apparatus for producing the semiconductor are disposed into a hole 12a of a ceramics bushing 12 and the insulating fluid 22, such as gaseous nitrogen, is supplied via a fluid outflow path 13 to enclose the circumference of the upper electrodes 10. The formation of the unnecessary plating metal and chemically converted film on the upper electrodes 10 is prevented by this enclosing means 11.
Inventors:
SUGANUMA HIROTARO
Application Number:
JP2307289A
Publication Date:
August 15, 1990
Filing Date:
January 31, 1989
Export Citation:
Assignee:
SUGANUMA HIROTARO
International Classes:
C25D5/08; C25D7/12; C25D17/00; C25D17/10; H01L21/321; H01L21/60; (IPC1-7): C25D5/08; C25D17/00; C25D17/10; H01L21/321