Title:
APPARATUS FOR REMOVING APPLIED SEALING BAND OF SHEET, ETC., AND METHOD FOR REMOVING APPLIED SEALING BAND
Document Type and Number:
Japanese Patent JP3682116
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To remove positively only an applied sealing band without moving sheets or the like in removing the applied sealing band applied to the sheets or the like.
SOLUTION: A processor 10 is equipped with a glue removing apparatus 30 for separating a bonded section formed between a top sheet p1 and a small band (k). The removing apparatus 30 has a bundle conveyor 31 on which a bundle (t) is placed, aligning plates 36a, 36b for aligning the bundle placed at the glue separating position on the bundle conveyor 31 and for holding the small band (k), arm members 37, 37 for pressing one end of the bundle (t) and for forming a clearance between the top sheet P1 and the small band (k), and a glue separating plate 38 that will be inserted into the clearance to separate the glued section. The aligning plates 36a, 36b, the arm members 37, 37, and the glue separating plate 38 are operated by an operating mechanism to remove the glued section.
Inventors:
Miura, Osamu
Matsumoto, Hideki
Matsumoto, Hideki
Application Number:
JP1996000116380
Publication Date:
May 27, 2005
Filing Date:
May 10, 1996
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B65B27/00; B65B69/00; B65B27/00; B65B69/00; (IPC1-7): B65B27/00; B65B69/00