To provide an apparatus for removing a plated layer of a two-piece wheel, which can remove the plated layer on the portion to be welded of the inside peripheral surface of a rim, and can obtain the two-piece wheel having a plated rim without requiring the complicated work.

The apparatus for removing the plated layer on the portion RW to be welded of the inside peripheral surface of the two-piece wheel composed of the rim 2 and a disk comprises a pair of supporting rollers 13 which are horizontally arranged, a positioning member 15 for positioning the rim 2 in the axial direction of the supporting rollers 13, a pair of holding rollers 19 for holding the rim 2 between the supporting rollers 13 and the holding rollers 19, a rotationally driving means for rotationally driving the held rim 2, and a polishing means for removing the plated layer on the portion RW to be welded by extending toward the inside of the rim 2 and by polishing the portion RW in the rim 2 to be welded with the disk.