Title:
APPARATUS FOR REPLENISHING ADDITIVE OF ELECTROPLATING BATH
Document Type and Number:
Japanese Patent JPS58217700
Kind Code:
A
Abstract:
PURPOSE:To make it possible to form a homogenous plating film having a uniform film thickness, by a method wherein the current of a plating bath in a plating tank is detected and the replenishing amount of an additive liquid is controlled in proportion to the detected value. CONSTITUTION:An anode 3 and an object 4 to be plated are set in a plating tank 1 having a plating bath accommodated therein so as to leave a predetermined interval therebetween and respectively connected to a power source 5. On the other hand, an additive 11 in an additive liquid tank 12 is replenished to the plating tank 1 through a pump 22. On the way of the line 6 connecting the anode 3 and the power source 5, a shunt 7 is provided to be connected to a preamplifier 21 which is in turn connected to the pump 2. The preamplifier 21 converts voltage from the shunt 7 to an industrial transmission signal of about D.C. 4-20mA and this signal is sent to the pump 22 to control the operation of the pump 22. By this mechanism, an operation time can be shortened and workability becomes good.
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Inventors:
SASABE TOSHIKI
Application Number:
JP9951082A
Publication Date:
December 17, 1983
Filing Date:
June 10, 1982
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
C25D21/14; (IPC1-7): C25D21/14
Attorney, Agent or Firm:
Takehiko Suzue
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