Title:
APPARATUS FOR SHAPING THE SURFACE OF CHEMICAL MECHANICAL POLISHING PAD
Document Type and Number:
Japanese Patent JP2018058203
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus for making pre-conditioned CMP pads that have a consistent pad surface microtexture while retaining their original surface topography.SOLUTION: The apparatus comprises: a rotary grinder assembly 4 having a rotor with a grinding surface of a porous abrasive material 2; a flat bed platen 1 for holding a CMP polishing layer 2 in place so that the grinding surface of the rotary grinder is disposed above and parallel to the surface of the flat bed platen to form an interface between a surface of the CMP polishing layer and the porous abrasive material; and a substrate holder 6 disposed above and parallel to a top surface of the flat bed platen so as not to overlap a region on which the rotary grinder assembly is mounted and to which a CMP substrate 7 is attached; thereby creating a polishing interface between the surface of the substrate and the CMP polishing layer to allow the substrate holder to rotate independently from the rotary grinder assembly and the flat bed platen.SELECTED DRAWING: Figure 3
Inventors:
JEFFREY JAMES HENDRON
JEFFREY ROBERT STACK
JEFFREY ROBERT STACK
Application Number:
JP2017184624A
Publication Date:
April 12, 2018
Filing Date:
September 26, 2017
Export Citation:
Assignee:
ROHM & HAAS ELECTRONIC MAT CMP HOLDINGS INC
International Classes:
B24B53/017; H01L21/304
Attorney, Agent or Firm:
Patent business corporation Tsukuni