APPARATUS FOR SOLDER JOINING METAL TAPE

Title:

APPARATUS FOR SOLDER JOINING METAL TAPE

Document Type and Number:

Japanese Patent JPH06122071

Kind Code:

A

Abstract:

PURPOSE: To prevent the deposition of undesirable particles with an apparatus for forming laminated metal tapes by joining the metal tapes.

CONSTITUTION: A converging channel 8 having an inlet end 10 and an outlet end 12 is delineated by a channel means 2 having a base 4, side wall means 6 and a cover 32. The cover is provided with a cavity facing the channel so that solder can flow through the cavity. Duct means 43' and 43" for feeding molten solder into the channel and allowing the molten solder to flow to the inlet end from the outlet end are mounted at the channel means. A sealing means 58 to permit the passage of the tapes and a wiper means 62 are disposed adjacently to the slot 56 passing the duct means in alignment to the outlet end.

Inventors:

ROBAATO JIYON ZABARA
BURUUSU ARAN NADOSEN
MAAKU GIRUBAATO BENTSU

Application Number:

JP5923693A

Publication Date:

May 06, 1994

Filing Date:

March 19, 1993

Export Citation:

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Assignee:

GEN ELECTRIC

International Classes:

B23K1/00; B23K1/08; B23K1/16; B23K1/19; B23K3/06; B32B15/01; C23C2/08; C23C2/10; H01B12/06; H01B13/00; H01L39/24; B23K103/16; (IPC1-7): B23K1/19; B23K1/00; B23K1/08; B23K3/06; B32B15/01; C23C2/08; C23C2/10; H01B13/00

Attorney, Agent or Firm:

Tokunji Ikunuma

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