To provide an apparatus for supplying vapor of adhesion reinforcing material for a light-sensitive resin film which can avoid destruction and peel-off of a light-sensitive resin film pattern formed on a semiconductor wafer, and also to provide a pre-treatment of the semiconductor wafer.

Adhesion reinforcing material in a liquid state contained in a liquid material tank 11 is compressed by a compression gas 6 into a vapor form. Concentration of the vaporized gas is detected by a concentration detector 17 and compared with a set value by a concentration comparison control device 18, and the compression gas 6 is adjusted by a compression gas mass flow/ compression control device 14 to control the concentration of a vaporized gas 23. In this way, since the control device is provided for keeping constant the concentration of the vaporized gas of the adhesion reinforcing material of a resist film, the adhesion of the resist film can be kept always constant, thus enabling avoidance of destruction and peel-off of a resist pattern.