Title:
APPARATUS FOR SUPPORTING MICROFILTER FOIL
Document Type and Number:
Japanese Patent JPS63107705
Kind Code:
A
Abstract:
A supporting structure consisting of two layers (a, b) is applied by electroplating to the back of the microfilter foil (3). The first, lower layer (b) consists of a number of columnar projections (5) which widen at their upper ends to form mushroom-shaped caps (4) which corrode together to form an extended second layer which leaves open macropores (6) free. As compared with the micropores of the microfilter foil, the coherent supporting structure has large pores and considerable stability.
Inventors:
EHRSAM CHRISTIAN (CH)
Application Number:
JP26518987A
Publication Date:
May 12, 1988
Filing Date:
October 20, 1987
Export Citation:
Assignee:
SULZER AG
International Classes:
B01D29/01; B01D29/11; B01D61/18; B01D63/00; B01D65/00; B01D67/00; B01D69/10; B01D71/02; C25D1/08; B01D29/94; (IPC1-7): B01D13/00; B01D13/04
Attorney, Agent or Firm:
Akira Asamura (3 outside)
Previous Patent: JPS63107704
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