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Title:
APPARATUS FOR TREATING CMP SLURRY WASTE LIQUID AND METHOD OF TREATING CMP SLURRY WASTE LIQUID
Document Type and Number:
Japanese Patent JP2010279933
Kind Code:
A
Abstract:

To provide an apparatus for treating CMP slurry waste liquid and a method of treating CMP slurry waste liquid which can be compactly configured and can clear the wastewater standard at a low cost.

By using the apparatus 1 for treating CMP slurry waste liquid, a solid material-removing process for removing solid material with a special filter 2, a COD adsorption process for adsorbing and removing a surfactant and organic material which raises COD with activated carbon, by using a COD adsorption tower 3 and a Cu ion-removing process for removing Cu ions by using a Cu-removing ion exchange resin tower 4 are continuously performed by means of a slurry waste liquid flow path 5. Therein, on the upper stream side than the Cu ion-removing process, the solid material-removing process and the COD adsorption process are performed and, thereby, only CMP slurry waste liquid is continuously and individually treated by the slurry waste liquid flow path 5.


Inventors:
HIMI HIDEKI
PUCHARAPARI SRINIVASULE REDDY
NAKAYAMA KENJI
Application Number:
JP2009137372A
Publication Date:
December 16, 2010
Filing Date:
June 08, 2009
Export Citation:
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Assignee:
ECOCYCLE CORP
NAKAYAMA KENJI
International Classes:
C02F11/12; C02F1/28; C02F1/42
Attorney, Agent or Firm:
Aperture Muneaki