Title:
APPLICATION APPARATUS
Document Type and Number:
Japanese Patent JP3227642
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To facilitate positioning of a plurality of application liquid supply nozzles supplied from different systems, to improve the throughput and to prevent the contamination of the application liquid supply nozzles.
SOLUTION: In an application apparatus, resist liquid is supplied to and applied onto the surface of a rotating wafer W through a plurality of resist liquid supply nozzles 23a to 23d. At this time, the plurality of resist liquid supply nozzles 23a to 23d connected to resist liquid supply sources of respective systems are movably located on a straight line L passing the rotational center O of the wafer W. Desired resist liquid supply nozzles 23a to 23d are moved to the center portion of the surface of the wafer W to thereby apply resist liquid onto the surface of the wafer W.
Inventors:
Masami Nakumoto
Application Number:
JP29213195A
Publication Date:
November 12, 2001
Filing Date:
October 13, 1995
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B05C11/08; B05D1/40; G03F7/16; H01L21/027; B05B12/14; (IPC1-7): H01L21/027; B05D1/40; G03F7/16
Domestic Patent References:
| JP63301520A | ||||
| JP5251329A | ||||
| JP5259063A | ||||
| JP5243140A | ||||
| JP6490530A |
Attorney, Agent or Firm:
Kikuhiko Nakamoto