To provide an application device of a resin solution in which breaking of a resin molded body is prevented by applying a resin solution to the maximum domain in the mold release layer not causing oxidation degradation while avoiding an oxidation degradation portion caused at heating of the mold release layer, and which can improve the use efficiency of a mold, and to provide a method of manufacturing an annular seamless molding using the application device.
The resin solution application device which applies a resin solution 4 on a mold release layer of a surface of a mold 2 includes: a dispensing apparatus (1) discharging the resin solution; and an application domain control means (6) which controls application domains (4, 5) by the dispensing apparatus based on the information for each mold. In addition, the method of manufacturing an annular seamless molding using the application device is disclosed.
HAGIWARA TOSHIHIRO
YAMAZAKI MASARU
HARA MASAKI
SHIBATA SEIJI
UKAI AKIO
Kyousei Tamura
Kitahara Yasuhiro
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