Title:
APPLICATION MECHANISM AND APPLICATION DEVICE
Document Type and Number:
Japanese Patent JP2022129878
Kind Code:
A
Abstract:
To provide an application mechanism which can ease an impact caused when an application needle contacts with an application surface without increasing manufacturing costs even when a disposable application needle holder and a disposable application needle are used or sterilization treatment is needed to be performed to the application needle holder and the application needle.SOLUTION: An application mechanism applies a liquid material onto an application surface. The application mechanism includes: an application needle holder fixing part; an application needle holder which is detachably attached to the application needle holder fixing part; an application needle held by the application needle holder; and a buffer mechanism. The buffer mechanism is configured to buffer an impact caused when the application needle contacts with the application surface.SELECTED DRAWING: Figure 4
Inventors:
YAMANAKA AKIHIRO
Application Number:
JP2021028734A
Publication Date:
September 06, 2022
Filing Date:
February 25, 2021
Export Citation:
Assignee:
NTN TOYO BEARING CO LTD
International Classes:
B05C1/02; B05C11/10
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office
Previous Patent: Program and Information Processing Equipment
Next Patent: MONITORING DEVICE, FAILURE DETECTION METHOD AND FAILURE DETECTION PROGRAM
Next Patent: MONITORING DEVICE, FAILURE DETECTION METHOD AND FAILURE DETECTION PROGRAM