Application structure of a solder paste - Shindengen Industry Co., Ltd.

Title:

Application structure of a solder paste

Document Type and Number:

Japanese Patent JP6066476

Kind Code:

B2

Inventors:

Brae Hoang

Application Number:

JP2013004921A

Publication Date:

January 25, 2017

Filing Date:

January 15, 2013

Export Citation:

Assignee:

Shindengen Industry Co., Ltd.

International Classes:

H05K3/34

Domestic Patent References:

Foreign References:

US6012231

Attorney, Agent or Firm:

Sumio Tanai
Yasushi Matsunuma
Hiroshi Masui
Toshio Komuro

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