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Title:
AQUEOUS ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2000119621
Kind Code:
A
Abstract:

To provide an aqueous adhesive composition which yields a good adhesion workability, has a high pressure resistance strength and even yields a boiling resistance as for durability when used as an adhesive for paper tubes.

This aqueous adhesive composition comprises a resin aqueous dispersion wherein a polymerizable unsaturated monomer is emulsion polymerized using as a protective colloid an aqueous polymer solution obtained by polymerizing a carboxyl group-containing polymerizable unsaturated monomer such as an acrylic acid, methacrylic acid, etc. in an aqueous solution of a saponification product of a vinyl acetate/ethylene copolymer. In the saponification product of a vinyl acetate/ethylene copolymerized polymer, the monomer weight ratio of vinyl acetate to ethylene is about from 99:1 to 70:30, the average degree of polymerization is about from 200 to 4,000 and the saponification degree is about from 90 to 99.5 mol%. As a polymerizable unsaturated monomer, which is a material monomer of the emulsion polymerization, e.g. a mixture of a methacrylic 1-5C alkyl ester and an acrylic 1-20C alkyl ester, etc. may be used.


Inventors:
HAYASHI SADAKATSU
YAMAMOTO SHINOBU
Application Number:
JP28931098A
Publication Date:
April 25, 2000
Filing Date:
October 12, 1998
Export Citation:
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Assignee:
KONISHI CO LTD
International Classes:
C08F2/22; C08F261/04; C09J125/04; C09J129/04; C09J133/06; C09J157/00; (IPC1-7): C09J157/00; C08F2/22; C09J125/04; C09J129/04; C09J133/06
Attorney, Agent or Firm:
Yukihisa Goto