Title:
水性下地処理剤、下地処理方法および下地処理された材料
Document Type and Number:
Japanese Patent JP4081276
Kind Code:
B2
Abstract:
Water-based, substrate treatment compositions contain (A) at least one chitosan selected from chitosan and a chitosan derivative, and (B) a metal compound containing at least one metal selected from Ti, Zr, Hf, Mo, W, Se, Ce, Fe, Cu, Zn, V and trivalent Cr. In particular, the water-based, substrate treatment compositions can improve the interlayer adhesion between metal materials and resin coating layers such as films or coatings, and can also improve the corrosion resistance and solvent resistance of such metal materials.
Inventors:
Kazuya Tanaka
Akio Shimizu
Ryoji Morita
Shinya Tsuchida
Masayuki Kobayashi
Takanori Yamanan
Akio Shimizu
Ryoji Morita
Shinya Tsuchida
Masayuki Kobayashi
Takanori Yamanan
Application Number:
JP2002004905A
Publication Date:
April 23, 2008
Filing Date:
January 11, 2002
Export Citation:
Assignee:
Nihon Parkerizing Co.,Ltd.
Dainichi Seika Kogyo Co., Ltd.
Dainichi Seika Kogyo Co., Ltd.
International Classes:
B05D7/24; C23C22/34; C09D5/12; C09D105/08; C23C22/40; C23C22/48; C23C22/56; C23C22/68
Domestic Patent References:
| JP2001049451A | ||||
| JP11350157A | ||||
| JP51047546A | ||||
| JP61211356A | ||||
| JP7148711U |
Attorney, Agent or Firm:
Katsuhiro Yoshida
Toshieko Kondo
Hiroshi Yoshida
Toshieko Kondo
Hiroshi Yoshida