To provide an aqueous curable resin composition having excellent stability and low-temperature curability of the composition, forming a cured product having excellent heat resistance and having excellent low irritation without causing medicine wounds, etc., by the composition.
The aqueous curable composition comprises a compound (A) containing ≥2 specific alkenyloxy groups in one molecule, a resin (B) having ≥1 hydroxy groups and ≥1 carboxy groups in one molecule, respectively at 0.55-1.25 equivalents/kg carboxy group concentration and a phosphoric acid compound (C). At least a part of the carboxy groups in the resin (B) and phosphate groups in the phosphoric acid compound (C) are neutralized and the compound (A), the resin (B) and the phosphoric acid compound (C) are dispersed in an aqueous medium.
YONEHARA YOICHI
ISOZAKI OSAMU
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