Title:
AQUEOUS CURING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3811046
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an aqueous curing resin composition which has excellent workability, safety or the like, and with which a cured product having excellent basic properties such as water resistance, heat resistance, weather resistance, strength and corrosion resistance can be obtained.
SOLUTION: The aqueous curing resin composition contains an aqueous resin dispersion composition and a curing agent. The aqueous resin dispersion composition is obtained by dispersing, in water, a reaction product of a bisphenol-type epoxy resin having 1.5-2.0 epoxy groups in average per one molecule and having a number average molecular weight of ≥2,000 with a carboxy group-containing resin and/or a phosphoric acid group-containing resin. The ratio of the bisphenol-type epoxy resin to the carboxy group-containing resin and/or phosphoric acid group-containing resin is 50/50 to 95/5.
Inventors:
Yoshiyuki Yokota
Application Number:
JP2001317383A
Publication Date:
August 16, 2006
Filing Date:
October 15, 2001
Export Citation:
Assignee:
Nippon Shokubai Co., Ltd.
International Classes:
C08L63/00; C09K3/10; C08G18/80; C08G59/40; C08G81/00; C08K3/20; (IPC1-7): C08L63/00; C08G81/00; C08K3/20; C09K3/10
Domestic Patent References:
| JP10060086A | ||||
| JP9227824A |
Attorney, Agent or Firm:
Yasuo Yasutomi
Takanori Tamai
Takanori Tamai
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