Title:
水性切削剤
Document Type and Number:
Japanese Patent JP5408251
Kind Code:
B2
Abstract:
An aqueous slicing fluid comprising (A) 0.01-20 wt% of a modified silicone is combined with abrasive grains to form an aqueous slicing slurry which has advantages of dispersion stability of abrasive grains, viscosity stability, and a higher machining accuracy.
Inventors:
Ichiro Tanii
Takayuki Hayashi
Toru Mizusaki
Takashi Kimura
Takayuki Hayashi
Toru Mizusaki
Takashi Kimura
Application Number:
JP2011518552A
Publication Date:
February 05, 2014
Filing Date:
June 09, 2010
Export Citation:
Assignee:
Nissin Chemical Industry Co., Ltd.
International Classes:
C10M155/02; C09K3/14; C10M105/14; C10M173/02; C10M175/00; B28D7/02; C10N20/00; C10N30/00; C10N30/02; C10N40/22; H01L21/304
Domestic Patent References:
| JPH07289803A | 1995-11-07 | |||
| JP2005132764A | 2005-05-26 | |||
| JP2004260123A | 2004-09-16 | |||
| JP2007063739A | 2007-03-15 | |||
| JP2007231384A | 2007-09-13 | |||
| JP2006278773A | 2006-10-12 | |||
| JPH07289803A | 1995-11-07 | |||
| JP2005132764A | 2005-05-26 | |||
| JP2004260123A | 2004-09-16 | |||
| JP2007063739A | 2007-03-15 |
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa