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Title:
AQUEOUS DISPERSION COMPOSITION FOR IMPARTING CHIPPING RESISTANCE
Document Type and Number:
Japanese Patent JP2011068912
Kind Code:
A
Abstract:

To provide an aqueous dispersion composition for imparting chipping resistance, which is obtained by dispersing a resin composition containing an olefinic thermoplastic elastomer, or a styrene-conjugated diene block copolymer or a hydrogenated product thereof into water and gives a coating film having excellent chipping resistance together with excellent coating film appearance, adhesion, heat resistance, moisture resistance and gasoline resistance, when used as an aqueous primer or an additive of an aqueous coating material.

The aqueous dispersion composition for imparting chipping resistance is obtained by dispersing non-volatile components (film-forming components) including (a') the styrene-conjugated diene block copolymer or hydrogenated product thereof into water, wherein 0.5-20 pts.mass of (b-3) a styrene-unsaturated acid compound copolymer is contained, based on 100 pts.mass of (a') the styrene-conjugated diene block copolymer or hydrogenated product thereof.


Inventors:
ARIKAWA HIDEO
TOKITA TAKU
Application Number:
JP2010287613A
Publication Date:
April 07, 2011
Filing Date:
December 24, 2010
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C08J3/05; C08F255/02; C08K5/17; C08L27/22; C08L35/00; C08L51/06; C08L53/02; C09D5/00; C09D5/02; C09D7/12; C09D151/06; C09D153/02; C09D201/00
Domestic Patent References:
JPH1129673A1999-02-02
JPH08505426A1996-06-11
JPH1129673A1999-02-02
JPH08505426A1996-06-11
Attorney, Agent or Firm:
Patent corporation ssinpat